CVD Wafer Stealth Dicing Machine

Item No.: SY-DS22A
This new model is for slicing large size CVD wafers, which solve the problem of materials loss, thermal and stress damage during processing with old methods and achieve zero edge chipping.
Description
This new model is for slicing large size CVD wafers efficiently, which solve the problem of materials loss, thermal and stress damage during processing with old methods and achieve zero edge chipping. 

CVD Wafer Stealth Dicing Machine 


Stealth Dicing samples